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MBRB4030
Preferred Device
SWITCHMODEt Power Rectifier
These state-of-the-art devices use the Schottky Barrier principle with a proprietary barrier metal.
Features http://onsemi.com
* * * * *
Guardring for Stress Protection Maximum Die Size 175C Operating Junction Temperature Short Heat Sink Tab Manufactured - Not Sheared Pb-Free Packages are Available
SCHOTTKY BARRIER RECTIFIER 40 AMPERES, 30 VOLTS
1 3 4
Mechanical Characteristics:
* Case: Epoxy, Molded, Epoxy Meets UL 94 V-0 * Weight: 1.7 Grams (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal
Leads Readily Solderable
* Device Meets MSL1 Requirements * ESD Ratings: Machine Model, C (>400 V)
Human Body Model, 3B (>8000 V)
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR) TC = +115C (Note 1) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz), TC = +112C Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) Storage Temperature Range Operating Junction Temperature Range (Note 2) Voltage Rate of Change (Rated VR) Reverse Energy (Unclamped Inductive Surge), (TC = 25C, L = 3.0 mH) Symbol VRRM VRWM VR IF(AV) IFRM Value 30 Unit V
4 1 3 D2PAK CASE 418B STYLE 3
MARKING DIAGRAM
40 80 A A AY WW B4030G AKA
IFSM
300
A A Y WW B4030 G AKA = Assembly Location = Year = Work Week = Device Code = Pb-Free Package = Diode Polarity
IRRM Tstg TJ dv/dt W
2.0 -65 to +175 -65 to +175 10,000 600
A C C V/ms mJ
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Rating applies when pins 1 and 3 are connected. 2. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RqJA.
(c) Semiconductor Components Industries, LLC, 2006
1
September, 2006 - Rev. 6
Publication Order Number: MBRB4030/D
MBRB4030
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient (Note 4) Symbol RqJC RqJA Value 1.0 50 Unit C/W C/W
ELECTRICAL CHARACTERISTICS
Characteristic Maximum Instantaneous Forward Voltage (Notes 3 and 5), per Device (IF = 20 A, TC = + 25C) (IF = 20 A, TC = +150C) (IF = 40 A, TC = + 25C) (IF = 40 A, TC = +150C) Maximum Instantaneous Reverse Current (Note 5), per Device (Rated DC Voltage, TC = + 25C) (Rated DC Voltage, TC = +125C) 3. Rating applies when pins 1 and 3 are connected. 4. Rating applies when surface mounted on the miniumum pad size recommended. 5. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0% Symbol VF 0.46 0.34 0.55 0.45 IR 0.35 150 mA Value Unit V
ORDERING INFORMATION
Device MBRB4030 MBRB4030G MBRB4030T4 MBRB4030T4G Package D2PAK D2PAK (Pb-Free) D2PAK D2PAK (Pb-Free) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Shipping 50 Units / Rail 50 Units / Rail 800 Units / Tape & Reel 800 Units / Tape & Reel
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MBRB4030
ELECTRICAL CHARACTERISTICS
I F, INSTANTANEOUS FORWARD CURRENT (A) (PIN 1 SHORTED TO PIN 3) TJ = 150C I F, INSTANTANEOUS FORWARD CURRENT (A) (PIN 1 SHORTED TO PIN 3) 100 100 TJ = 150C
10
10
1.0
100C
25C
1.0
100C
25C
0.1
0
0.1
0.2 0.3 0.4 0.5 0.6 VF, INSTANTANEOUS VOLTAGE (V)
0.7
0.8
0.1
0
0.1
0.2 0.3 0.4 0.5 VF, INSTANTANEOUS VOLTAGE (V)
0.6
0.7
Figure 1. Maximum Forward Voltage
Figure 2. Typical Forward Voltage
1.0 I R , REVERSE CURRENT (A) TJ = 150C
1.0 TJ = 150C 0.1 100C
I R , REVERSE CURRENT (A)
0.1 0.01 10-3 10-4 10-5
100C
0.01
10-3 10-4 10-5 25C
25C
0
5
20 10 15 VR, REVERSE VOLTAGE (V)
25
30
0
5
15 20 10 VR, REVERSE VOLTAGE (V)
25
30
Figure 3. Maximum Reverse Current
Figure 4. Typical Reverse Current
104 TJ = 25C C, CAPACITANCE (pF)
TYPICAL
MAXIMUM
1000
1
10 VR, REVERSE VOLTAGE (V)
Figure 5. Maximum and Typical Capacitance
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MBRB4030
ELECTRICAL CHARACTERISTICS
70 60 50 40 30 20 10 0 100 110 10 20 120 130 140 TC, CASE TEMPERATURE (C) 150 SQUARE WAVE DC (RESISTIVE LOAD) IPK = 5.0 (CAPACITIVE IAV LOAD) 20 DC SQUARE WAVE (RESISTIVE LOAD)
I F(AV), AVERAGE FORWARD CURRENT (A) (PIN 1 SHORTED TO PIN 3)
I F(AV), AVERAGE FORWARD CURRENT (A) (PIN 1 SHORTED TO PIN 3)
RqJA = 25C/W SURFACE MOUNTED ON MINIMUM RECOMMENDED PAD SIZE IPK = 5.0 (CAPACITIVE IAV LOAD)
15
10 10 5 20 0
50 100 TA, AMBIENT TEMPERATURE (C)
150
Figure 6. Current Derating, Infinite Heatsink
PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS) (PIN 1 SHORTED TO PIN 3)
Figure 7. Current Derating
I F(AV), AVERAGE FORWARD CURRENT (A) (PIN 1 SHORTED TO PIN 3)
12 10 8 6 4 2 0 10 20 DC (RESISTIVE LOAD) SQUARE WAVE
RqJA = 50C/W
50 TJ = 150C (RESISTIVE LOAD) IPK = 5.0 (CAPACITIVE IAV LOAD) 20 10 SQUARE WAVE
40 30
IPK = 5.0 (CAPACITIVE IAV LOAD)
20 10 0
DC
0
50 100 TA, AMBIENT TEMPERATURE (C)
150
0
10
30 50 20 40 60 IF(AV), AVERAGE FORWARD CURRENT (A)
70
80
Figure 8. Current Derating, Free Air
Figure 9. Forward Power Dissipation
1.0 R(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZED) SINGLE PULSE
0.1
tp
Ppk t1
Ppk TIME
DUTY CYCLE, D = tp/t1 PEAK POWER, Ppk, is peak of an equivalent square power pulse.
DTJL = Ppk * RqJL [D + (1 - D) * r(t1 + tp) + r(tp) - r(t1)] where DTJL = the increase in junction temperature above the lead temperature r(t) = normalized value of transient thermal resistance at time, t, for example, r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp.
0.01
0.1
1.0 t, TIME (ms)
10
100
1000
Figure 10. Thermal Response
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MBRB4030
PACKAGE DIMENSIONS
D2PAK 3 CASE 418B-04 ISSUE J
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B-01 THRU 418B-03 OBSOLETE, NEW STANDARD 418B-04. DIM A B C D E F G H J K L M N P R S V INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40
C E -B-
4
V W
A
1 2 3
S
-T-
SEATING PLANE
K G D 3 PL 0.13 (0.005) H
M
W J
TB
M
VARIABLE CONFIGURATION ZONE L M
R
N U L
P L M
STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE
M
F VIEW W-W 1
F VIEW W-W 2
F VIEW W-W 3
SOLDERING FOOTPRINT*
8.38 0.33
10.66 0.42
1.016 0.04
5.08 0.20
3.05 0.12 17.02 0.67
SCALE 3:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MBRB4030
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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MBRB4030/D

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